Copper ≥99.5% (trace metals basis), foil not certified pinhole-free, Thickness 0.01 mm

Supplier: BeanTown Chemical

222235-100X100 222235-25X25MM 222235-50X50MM
BT222235-100X1EA 169 USD
BT222235-100X1 BT222235-25X25 BT222235-50X50
Copper ≥99.5% (trace metals basis), foil not certified pinhole-free, Thickness 0.01 mm
Copper

CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94


  • RTECS: GL5325000
  • Solid

Formula: Cu
MW: 63.55 g/mol
Boiling Pt: 2595
Melting Pt: 1083
Density: 8.94 g/mL
MDL Number: MFCD00010965
CAS Number: 7440-50-8
EINECS: 231-159-6
Merck Index: 13,02545

Order Now

Specification Test Results

Assay 99.5%


Learn more

About VWR

Avantor is a vertically integrated, global supplier of discovery-to-delivery solutions for...

Learn more About VWR