Copper ≥99.5% (trace metals basis), foil not certified pinhole-free, Thickness 0.01 mm
Supplier: BeanTown Chemical
222235-100X100
222235-25X25MM
222235-50X50MM
BT222235-100X1EA
169
USD
BT222235-100X1
BT222235-25X25
BT222235-50X50
Copper ≥99.5% (trace metals basis), foil not certified pinhole-free, Thickness 0.01 mm
Copper
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000
Solid; Molecular Formula: Cu; MW: 63.55
Melting Point: 1083.4°; Boiling Point: 2567°
Density (g/mL): 8.94
- RTECS: GL5325000
- Solid
Formula:
Cu MW: 63.55 g/mol Boiling Pt: 2595 Melting Pt: 1083 Density: 8.94 g/mL |
MDL Number:
MFCD00010965 CAS Number: 7440-50-8 EINECS: 231-159-6 Merck Index: 13,02545 |
Specification Test Results
Assay | 99.5% |
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