Copper ≥99.9999% (trace metals basis), foil, Thickness 0.5 mm

Supplier: BeanTown Chemical

138070-100X100 138070-50X50MM
BT138070-100X1EA 357 USD
BT138070-100X1 BT138070-50X50
Copper ≥99.9999% (trace metals basis), foil, Thickness 0.5 mm
Copper

CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94


  • Solid

Formula: Cu
MW: 63.55 g/mol
Boiling Pt: 2595
Melting Pt: 1083
Density: 8.94 g/mL
MDL Number: MFCD00010965
CAS Number: 7440-50-8
EINECS: 231-159-6
Merck Index: 13,02545

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Specification Test Results

Assay 99.9999%


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